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MECHANIC GR300 is a professional-grade, high-efficiency chip degumming liquid designed for electronic repairs. Specially formulated to dissolve and soften black glue, epoxy resins, and stubborn adhesives surrounding CPUs, ICs, and delicate microchips on smartphone motherboards. Its advanced formula penetrates quickly within minutes, allowing for safe and easy glue removal without damaging PCB traces or sensitive surrounding components. An essential tool for technicians during chip desoldering, reballing, and cleaning processes.
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