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MECHANIC CPG90 Beta CPU Solder Paste (50g / 199°C)

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5.00JD

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  5.00JD

Detail Description

MECHANIC CPG90 Beta (50g) is a professional-grade, high-performance liquid solder paste engineered with a specialized high melting point of 199°C. Formulated specifically for Android smartphone CPU reballing and micro-component tin planting, this advanced alloy paste delivers exceptional mechanical strength and robust joints capable of withstanding the high thermal output of modern mobile processors. Its premium, uniform texture applies smoothly into stencils, eliminating clumping and minimizing the risk of solder bridging. It ensures bright, factory-quality, and highly reliable solder balls that prevent future hardware degradation or chip disconnection.



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MECHANIC CPG90 Beta CPU Solder Paste (50g / 199°C)
5.00JD 0.00JD
5.00JD
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