MECHANIC Hanjiang 3D-XS-M Pro 3D BGA Reballing Stencil Set for iPhone X/XS/XS Max

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MECHANIC Hanjiang 3D-XS-M Pro is a professional-grade, high-end 3D BGA reballing stencil set engineered exclusively for the double-stacked logic boards and IC maintenance of iPhone X, XS, and XS Max. Featuring an innovative 3D stepped groove design, this premium template set securely self-aligns and locks chips into place, preventing micro-components from shifting under high temperatures. Laser-cut from premium anti-bulging, heat-resistant steel with precision-square apertures, it ensures uniform solder paste release and prevents structural bridging. It is an indispensable asset for master hardware technicians working under microscopes to execute flawless middle-layer board separation bonding, CPU/Nand reballing, and anchoring fragile internal flex lines (Zadla).