MECHANIC IP16 Series Heating Module Platform with 2pcs Reballing Steel Stencils

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MECHANIC IP16 is a professional-grade, high-end motherboard heating module and reballing kit engineered exclusively for uniform layer separation, precise thermal splitting, and safe BGA rework on iPhone 16 through 16 Pro Max logic boards. Formulated with an advanced high-density thermal core architectural layout, this premium platform ensures absolute micro-accuracy and uniform heat distribution across double-stacked PCBs to eliminate structural warping. The module comes complete with 2 custom-machined, high-temperature resistant steel stencils that align perfectly under the microscope, locking components firmly in place to eliminate micro-vibrations and ensure zero risk of lifting copper pads or causing mechanical tearing to fragile internal flex lines (Zadla). Featuring integrated safety cooling layout structures, this multi-functional workstation stands as a global workbench standard for factory-grade multi-layered PCB restoration and premium hardware reliability.