MECHANIC IPX-11 Series Heating Module Platform with 5pcs Reballing Steel Stencils

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MECHANIC IPX-11 is a professional-grade, high-end motherboard heating module and reballing kit engineered exclusively for uniform layer separation, precise thermal splitting, and safe BGA rework on iPhone X through 11 Pro Max logic boards. Formulated with an advanced high-density thermal core architectural layout, this premium platform ensures absolute micro-accuracy and uniform heat distribution across double-stacked PCBs to eliminate structural warping. The module comes complete with 5 custom-machined, high-temperature resistant steel stencils that align perfectly under the microscope, locking components firmly in place to eliminate micro-vibrations and ensure zero risk of lifting copper pads or causing mechanical tearing to fragile internal flex lines (Zadla). Featuring integrated safety cooling layout structures, this multi-functional workstation stands as a global workbench standard for factory-grade multi-layered PCB restoration and premium hardware reliability.