MECHANIC iTin 35 High-End BGA Steel Reballing Stencil for Huawei P30 Pro Motherboard

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MECHANIC iTin 35 is a professional-grade, high-end motherboard BGA reballing steel stencil engineered exclusively for the intricate hardware maintenance and chip reballing of the Huawei P30 Pro. Laser-cut from premium, heat-resistant anti-deformation steel, this specialized template features precisely calibrated micro-square apertures tailored perfectly to the Kirin CPU matrix and peripheral IC pin arrays, ensuring uniform solder paste distribution and preventing micro-bridging during high-temperature reflow. It is an indispensable asset for master hardware technicians working under microscopes to execute flawless processor seating, rebuild missing pad matrices, and anchor fragile internal flex lines (Zadla) with absolute reliability.