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MECHANIC SD360 Max is a professional-grade, high-viscosity flux paste engineered for advanced smartphone motherboard repair and high-density SMD/BGA reballing. Packaged in a 10CC syringe, this premium formula is entirely halogen-free and eco-friendly, offering exceptional thermal stability and superb wetting characteristics to ensure uniform solder flow without bridge shorts. Featuring a specialized no-clean chemistry, it leaves behind a minimal, optically clear, non-conductive, and non-corrosive residue under a microscope, making it an indispensable asset for master technicians executing delicate IC replacements, running microscopic jumper wires, and anchoring internal flex lines (Zadla).
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