Your cart is empty, and it looks like you haven’t added anything yet.
Repairman's Aegis iT3 Pro (14 Series) is a professional-grade, high-end motherboard heating module and middle-layer reballing kit engineered exclusively for uniform layer separation, precise thermal splitting, and safe BGA rework on iPhone 14 series logic boards. Formulated with an advanced high-density thermal core architectural layout, this premium platform ensures absolute micro-accuracy and uniform heat distribution across double-stacked PCBs to eliminate structural warping. The kit comes complete with 1 specialized heating module and 2 custom-machined, high-temperature resistant middle-layer steel stencils that align perfectly under the microscope, locking components firmly in place to eliminate micro-vibrations and ensure zero risk of lifting copper pads or causing mechanical tearing to fragile internal flex lines (Zadla). Featuring integrated safety cooling layout structures, this multi-functional workstation stands as a global workbench standard for factory-grade multi-layered PCB restoration and premium hardware reliability.
No review given yet!
Fast Delivery all across the country
Safe Payment
7 Days Return Policy
100% Authentic Products
You need to Sign in to view this feature
This address will be removed from this list